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Title:
回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
Document Type and Number:
Japanese Patent JP4852785
Kind Code:
B2
Inventors:
Akira Nagai
Satoru Daejeon
Masami Yusa
Application Number:
JP2000363105A
Publication Date:
January 11, 2012
Filing Date:
November 29, 2000
Export Citation:
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Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C09J4/02; C09J7/00; C09J9/02; C09J11/00; C09J163/00; C09J171/00; H01B1/22; H01L21/60; H01R11/01
Domestic Patent References:
JP10273540A
JP2001176335A
JP2001049209A
JP10168413A
JP9169958A
JP11279511A
JP11238538A
JP11302373A
JP2000129217A
JP62108090A
JP63019284A
JP2000129157A
JP10021741A
Foreign References:
WO1998044067A1
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hiroto Kido
Masato Ikeda



 
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