To provide a film-like adhesive which enables to mount a semiconductor element on a wiring board while sufficiently preventing bad conditions such as air entrainment and resin creeping-up and which enables to widen the temperature range wherein the semiconductor element can be mounted on the wiring board.
The film-like adhesive is formed by shaping an adhesive composition into a film shape. The adhesive composition contains (A) an epoxy resin, (B) silica, (C) an epoxy resin curing agent and (D) an organic solvent. The content of the silica (B) in the adhesive composition is in the range of 10-50 mass% in terms of solids, and the epoxy resin curing agent (C) is the one that has resistance to the organic solvent (D) and a melting point of 150C. The film-like adhesive satisfies specific requirements with respect to the relationships between the measured temperature and the melt viscosity as it is elevated in temperature at the temperature-rise speed of 10C/min from room temperature.
TAICHI HIDEKAZU
KIRIKAE TOKUYUKI
| JPS6429418A | 1989-01-31 | |||
| JP2000204324A | 2000-07-25 | |||
| JP2002093825A | 2002-03-29 | |||
| JP2004123874A | 2004-04-22 | |||
| JP2004161828A | 2004-06-10 | |||
| JP2005019516A | 2005-01-20 | |||
| JP2005032961A | 2005-02-03 | |||
| JP2006100784A | 2006-04-13 | |||
| JP2007138149A | 2007-06-07 | |||
| JP2008038111A | 2008-02-21 | |||
| JPS6429418A | 1989-01-31 | |||
| JP2000204324A | 2000-07-25 | |||
| JP2002093825A | 2002-03-29 | |||
| JP2004123874A | 2004-04-22 | |||
| JP2004161828A | 2004-06-10 | |||
| JP2005019516A | 2005-01-20 | |||
| JP2005032961A | 2005-02-03 | |||
| JP2006100784A | 2006-04-13 | |||
| JP2007138149A | 2007-06-07 | |||
| JP2008038111A | 2008-02-21 |