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Title:
FILM AND PACKAGING DEVICE FOR ELECTRONIC PART
Document Type and Number:
Japanese Patent JPS5853972
Kind Code:
A
Abstract:

PURPOSE: A film useful for a packaging device for electronic parts, preventing the charge of film simply and inexpensively, preventing the antistatic adeposition of electronic parts to the film, obtained by coating the surface of the film with a thermoplastic adhesive containing carbon.

CONSTITUTION: For example, a large number of the holes 2 are formed in the longer direction on the continuous belt 1, the film 3 is applied to its back, the electronic parts 5 are put in each of the holes 2, the film 3 having the surface coated with the thermoplastic adhesive 6 containing carbon is applied to the surface of the continuous belt 1, and the belt is sealed, to give a packaging device for electronic parts. Press bonding under heating is used for bonding the film 3 to the continuous belt 1.


Inventors:
KASHIWAJIMA TADASHI
Application Number:
JP15225681A
Publication Date:
March 30, 1983
Filing Date:
September 26, 1981
Export Citation:
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Assignee:
ROHM KK
International Classes:
C09J7/02; B65D85/38; B65D85/86; (IPC1-7): B65D85/38; C09J7/02
Domestic Patent References:
JPS5076150A1975-06-21
JPS5443155A



 
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