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Title:
FILM PATTERN FORMING METHOD, MANUFACTURING METHOD OF DEVICE, ELECTRO-OPTIC DEVICE, AND ELECTRONIC APPLIANCE
Document Type and Number:
Japanese Patent JP2007275732
Kind Code:
A
Abstract:

To provide a film pattern forming method enabling a uniformization by controlling easy a film thickness of the film pattern having a wide part and a minute part, a manufacturing method of a high-performance device equipped with the film pattern uniform in such film thickness, an electro-optic device having a high display quality, and an electronic appliance.

The method of forming the predetermined film pattern arranging a functional fluid on a substrate is provided. The method comprises a pattern area forming process of forming the pattern area having the wide part and the minute part connected to the wide part on the substrate, the functional fluid arranging process arranging the functional fluid in the pattern area by discharging selectively the functional fluid to the wide part, and a drying process of forming the film pattern by drying the functional fluid while giving a temperature gradient from the wide portion in a direction toward the minute part.

COPYRIGHT: (C)2008,JPO&INPIT


Inventors:
TOYODA NAOYUKI
Application Number:
JP2006104003A
Publication Date:
October 25, 2007
Filing Date:
April 05, 2006
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B05D3/00; B05D7/00; G02F1/1343
Domestic Patent References:
JP2005012181A2005-01-13
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama