Title:
FILM QUALITY EVALUATION METHOD AND DEVICE, LINE WIDTH VARIATION EVALUATION METHOD AND DEVICE, AND PROCESSING METHOD AND DEVICE HAVING LINE WIDTH VARIATION EVALUATION FUNCTION
Document Type and Number:
Japanese Patent JP3672529
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a film quality evaluation method and a device capable of easily evaluating the quality uniformity of a resist film in a short time, a line width variation evaluation method and a device capable of evaluating a variation in the widths of lines on the basis of the evaluation of the film quality, and a processing method and a device having a film quality evaluation function to improve the line width, on the basis of the evaluation of variation in the line width.
SOLUTION: A resist solution is applied on the surface of a wafer W to form a resist film 80, the wafer W is heated so as to make a solvent contained the resist film 80 evaporate, then the thickness of the resist film 80 is measured at several spots on different concentric circles, before and after a developing process is carried out, reduction in the thickness of the resist film 80 is calculated at several spots on the different concentric circles on the basis of the measured value difference caused by a developing process, and the quality of the resist film 80 is evaluated on the basis of the amount of reductions in the thickness of the film 80.
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Inventors:
Hiro Shinya
Takahiro Kitano
Takahiro Kitano
Application Number:
JP2001390743A
Publication Date:
July 20, 2005
Filing Date:
December 25, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G03F7/26; G03F7/30; H01L21/027; (IPC1-7): H01L21/027; G03F7/26; G03F7/30
Domestic Patent References:
| JP9218500A | ||||
| JP2001196298A | ||||
| JP11194506A | ||||
| JP2110918A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto