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Patent Searching and Data


Title:
FILM RELEASING METHOD AND FILM STICKING METHOD
Document Type and Number:
Japanese Patent JP2000351191
Kind Code:
A
Abstract:

To reduce the consumption of an adhesive material by releasing the ends of cover films by the adhesive material and then delivering the ends of the cover films to a clamping device and continuously releasing the cover films from a multilayer film after separating the adhesive material from the cover films.

Respective bases 1 are carried at intervals L1 on a carrying roll 2 constituting a carrying line, and perforations are formed in the width direction of films from a film roll 3 by a perforation forming unit 7. Then cover films 6 corresponding to sections required for sticking the films are released by a cover film release unit 22, and resist films 5 are pressure bonded on the bases 1 by the pressure rollers 16a and 16b. As the cover films 6 still remain on sections L2, on which the sticking on the bases is not required, the resist films 5 can be pressure bonded only on the required sections of the bases. Thus the quantity of the adhesive material 13 (adhesive type) consumed when cover films 6 are released can be reduced.


Inventors:
NUMAJIRI FUMIAKI
MOMOCHI HIDEKAZU
Application Number:
JP16584599A
Publication Date:
December 19, 2000
Filing Date:
June 11, 1999
Export Citation:
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Assignee:
HITACHI TECHNO ENG
International Classes:
H05K3/28; B29C65/78; B32B43/00; (IPC1-7): B32B35/00; B29C65/78; H05K3/28
Attorney, Agent or Firm:
Yukihiko Takada (1 outside)