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Title:
FILM SUBSTRATE AND PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2006111646
Kind Code:
A
Abstract:

To solve problems of flexibility, hand cutting properties and abrasion resistance in a pressure-sensitive adhesive tape using a film made of a nonhalogen resin composition as a raw material when employed as a tape for binding complicated electric wire cables in an automotive engine room, etc.

A film substrate comprises 100 pts. mass of an aromatic vinylic elastomer, 10-60 pts. mass of a styrenic resin and 1-50 pts. mass of a maleimide copolymer prepared by polymerizing 15-70 mass% of an aromatic vinyl monomer with 30-85 mass% of an unsaturated dicarboximide derivative. The pressure-sensitive adhesive tape is obtained by using the film substrate.


Inventors:
HASUMI SUIKI
SAIDA SEIJI
SUZUKI KAZUO
Application Number:
JP2004297175A
Publication Date:
April 27, 2006
Filing Date:
October 12, 2004
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
C08L9/06; C08J7/00; C08K3/00; C08L53/02; C09J7/02; C09J201/00; C08L25/04; C08L35/06
Domestic Patent References:
JP2002121355A2002-04-23
JPH0457845A1992-02-25
JPH06192518A1994-07-12
JP2002105154A2002-04-10
JP2001302854A2001-10-31
JP2000273405A2000-10-03
JP2002121355A2002-04-23
JPH0457845A1992-02-25
JPH06192518A1994-07-12
JP2002105154A2002-04-10
JP2001302854A2001-10-31
JP2000273405A2000-10-03



 
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