Title:
FILM SUBSTRATE STRUCTURE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP2813138
Kind Code:
B2
Abstract:
PURPOSE: To reinforce holes for film feeding, in a film substrata, and prevent the holes from being deformed, by forming the holes for film feeding, and arranging a copper foil on the peripheral end edges of the holes.
CONSTITUTION: After a copper foil 3 is stuck on a belt plastic film 2, a film substrata 1 is subjected to masking, and patterns 4, 4 are formed by etching. The copper foil 3 is plated with conductive material 5, and a plurality of holes for film feeding are formed at equal pitches on the film 2. In the film substrate 1, an IC is mounted on each of the patterns 4, and an IC chip is formed for each of the pattern 4 by bonding. After that, each of the IC chips is separated from the film substrate 1, and mounted on, e.g. an IC card. When external force is applied by metal pins, it acts on the copper foil 3 on the peripheral end edges of holes 6. Thereby the holes of the thin film 2 are protected, so that the holes can be prevented from being deformed.
Inventors:
Nobuyuki Fujita
Application Number:
JP20242294A
Publication Date:
October 22, 1998
Filing Date:
August 26, 1994
Export Citation:
Assignee:
Rhythm Watch Industry Co., Ltd.
International Classes:
H05K1/02; H01L21/60; H05K1/00; H05K3/00; (IPC1-7): H05K1/02; H01L21/60
Domestic Patent References:
| JP5190593A | ||||
| JP6117751U |
Attorney, Agent or Firm:
Mori Masazumi
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