Title:
FILM SUBSTRATE
Document Type and Number:
Japanese Patent JP2012074492
Kind Code:
A
Abstract:
To provide a film substrate in which occurrence of cracking or disconnection in an I/O outer lead can be prevented.
The film substrate comprises a base film 2, and a plurality of I/O outer leads 3, 4 formed at both ends of the base film 2 while being arranged, and external substrates are connected electrically each other by connecting the plurality of I/O outer leads 3 and 4 formed at both ends of the base film 2 electrically with the external substrates. Metal patterns 7 for reinforcement that prevent disconnection of the plurality of I/O outer leads 3 and 4 by minimizing deformation of the base film 2 are formed on both sides of the plurality of I/O outer leads 3 and 4 formed at both ends of the base film 2.
Inventors:
KAMEI MASARU
Application Number:
JP2010217450A
Publication Date:
April 12, 2012
Filing Date:
September 28, 2010
Export Citation:
Assignee:
HITACHI CABLE FILM DEVICE LTD
International Classes:
H01L21/60; H05K1/02; H05K1/11; H05K1/14
Attorney, Agent or Firm:
Nobuo Kinutani