Title:
膜厚管理装置
Document Type and Number:
Japanese Patent JP6913905
Kind Code:
B2
Abstract:
To manage the film thickness of a target object even if the orientation of a light source is low.SOLUTION: A film thickness management device (100) manages the film thickness of a target object (O). The film thickness management device (100) includes a light source (110), a light receiving sensor (120), and an enclosure member (130). The light source (110) emits emission light (LO) to the target object (O). The light receiving sensor (120) detects reflected light (LR), which is the emission light (LO) reflected by the target object (O). The enclosure member (130) encloses the light receiving sensor (120). The enclosure member (130) includes: an inner periphery light shielding side surface (132) for blocking the emission light (LO); and a light passage end surface (134) facing the target object (O), the light passage end surface causing the emission light (LO) to pass.SELECTED DRAWING: Figure 1
Inventors:
Kenji Yamamura
Application Number:
JP2018019346A
Publication Date:
August 04, 2021
Filing Date:
February 06, 2018
Export Citation:
Assignee:
Sanyo Cwipee Co., Ltd.
International Classes:
G01B11/02; B41F33/00
Domestic Patent References:
JP2013096948A | ||||
JP2008304284A | ||||
JP10026524A | ||||
JP10332343A | ||||
JP9113231A | ||||
JP2012013768A |
Foreign References:
US20080144049 |
Attorney, Agent or Firm:
Hiroyuki Maei