PURPOSE: To eliminate the need for an original film for formation of patterns and to eliminate the need for a washing process by providing a resist layer and a hot melt layer on a base and further providing a base on the hot melt layer at need.

CONSTITUTION: This resist is formed by successively laminating the resist layer consisting of a UV curing type resist or the like and the hot melt layer essentially consisting of a low melting compd. on the base (A) consisting of a polyester film or the like and laminating the base (B) on the hot melt layer as well at need. For example, this resist is mounted on a thermal printer and is printed with desired circuit patterns. The base A is then peeled and the circuit patterns are formed on the base B. The base B is then superposed on a printed circuit board in such a manner that the patterns face each other. After the circuit board and the base are brought into thermal contact with each other, the base is irradiated with UV rays to cure the pattern parts; thereafter, the base B is stripped. The circuit patterns are thus formed on the circuit board.