Title:
FINE PARTICLE ALIGNED CONDUCTIVE CONNECTION FILM, MANUFACTURING METHOD OF FINE PARTICLE ALIGNED CONDUCTIVE CONNECTION FILM AND CONDUCTIVE CONNECTION STRUCTURAL BODY
Document Type and Number:
Japanese Patent JP2002313143
Kind Code:
A
Abstract:
To provide a fine particle aligned conductive connection film, a manufacturing method of the fine particle aligned conductive connection film and a conductive connection structural body enabling an electric connection with ease in a short time without leak between adjacent electrodes and with high connection reliability.
With the fine particle aligned conductive connection film with conductive fine particles inserted into penetration holes made on an adhesive resin film, at least a part of the above fine particles is exposed on both sides of the adhesive resin film, where, the adhesion strength on a board and chips is not less than 784.4 kPa.
Inventors:
FUKUOKA MASATERU
SUZUKI TAKUO
IUCHI KENJI
SUZUKI TAKUO
IUCHI KENJI
Application Number:
JP2001120076A
Publication Date:
October 25, 2002
Filing Date:
April 18, 2001
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B29C43/02; H01B5/00; H01B5/16; H01B13/00; H01R11/01; (IPC1-7): H01B5/16; B29C43/02; H01B5/00; H01B13/00; H01R11/01
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