Title:
FINE PATTERNING METHOD OF POLYIMIDE RESIN
Document Type and Number:
Japanese Patent JP2006110956
Kind Code:
A
Abstract:
To provide an excellent method of stamping molding to form a fine pattern irrespective of the glass transition point of a polyimide resin.
The method of fine patterning a polyimide resin comprises the steps of coating a substrate surface with a polyamic acid solution, partially drying the solution, thermocompression-bonding a molding material heated at 100°C or higher on the substrate in a depressurized vessel, and peeling off the molding material to form a fine pattern. Preferably, the viscosity of the polyamic acid solution is not smaller than 50 Pa s and not larger than 3,000 Pa s at 23°C and the solid concentration is 5-40 wt%.
Inventors:
FUJIWARA HIROSHI
Application Number:
JP2004303379A
Publication Date:
April 27, 2006
Filing Date:
October 18, 2004
Export Citation:
Assignee:
KANEKA CORP
International Classes:
B29C39/02; H01L21/027; B29K79/00
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