PURPOSE: To obtain the subject compound having a specific average particle diameter, excellent in dispersibility in organic solvents, water and resin raw materials without deteriorating the heat resistance, moisture resistance, water resistance, electric insulation, etc., of epoxy resins, large in the curing speed, and useful as a curing agent for the epoxy resins.
CONSTITUTION: A hydrazide compound having one or more hydrazide groups in the molecule {e.g. a compound of formula I [R is H, an alkyl, a (substituted) aryl, hydrazino], a compound of formula II [A is a (substituted)alkylene, a (substituted)arylene, oxo; (n) is 0,1]}. The hydrazide compound has an average particle diameter of 0.5-20μm, especially 1-5μm, and preferably surface-coated with a coupling agent such as a silane, titanate, aluminum or phosphorus coupling agent.
HAYASHI HIROYASU
MAEKAWA TSUKASA
