FINE RECESSED AND PROJECTED PATTERN FORMING METHOD

Title:

FINE RECESSED AND PROJECTED PATTERN FORMING METHOD

Document Type and Number:

Japanese Patent JPS62136320

Kind Code:

A

Abstract:

PURPOSE: To easily form a desired fine recessed and projected patterns on a work surface, by selectively grinding the work after irradiating laser beam of a desired diameter and energy to the work surface.

CONSTITUTION: A hardened member 1 as a work is fixed on a stage and laser beam is irradiated at random. Or the laser beam is irradiated to a desired pattern to produce a distribution of residual stress of the desired pattern on the surface of the work. Then, the work is ground so that fine recesses and projections 2 are produced on the work. Difference of grinding caused by the presence and absence of the residual stress and its ununiformity is produced and then the desired recesses and projections re formed according to the residual stress.

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Inventors:

NANBA YOSHIHARU
YOSHIDA AKIO
KAWAGUCHI KENJI

Application Number:

JP27551885A

Publication Date:

June 19, 1987

Filing Date:

December 05, 1985

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

B23P9/00; B23K26/00; (IPC1-7): B23K26/00; B23P9/00

Attorney, Agent or Firm:

Masuo Oiwa

Previous Patent: JPS62136319

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