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Title:
FINISHING METHOD FOR SURFACE LUSTER OF PLATED WIRE
Document Type and Number:
Japanese Patent JPS5699011
Kind Code:
A
Abstract:

PURPOSE: To give an excellent surface luster to the plated wire, by arranging at an interval in series plural dies possessing die holes in diameter large than that of the metallic wire electrically plated at its surface, and by giving an eccentricity in respective direction so as to change the contact part between the surface of the plated wire and the die hole.

CONSTITUTION: The dies 2-1W2-4, possessing die holes in diameter 1.05W2.0 times sectional area of the plated wire 1, are arranged at an interval 20W70mm in series. The plated wire 1 is passed through the die holes 3-1W3-4 of the dies 2-1W2-4. The die holes 3-1W3-4 are arranged eccentrically against the plated wire 1 so as to locate at a constant interval the contact points A1WA4 between each of die holes 3-1W 3-4 and the surface of the plated wire 1. As the number of dies, three to nine are suitable; besides, the die holes 3-1W3-4 are desired to be arranged so as to locate the die centers C1WC4 at 1W5mm outside of the center 0 of the plated wire 1.


Inventors:
SHINODA TAKEHIKO
Application Number:
JP73480A
Publication Date:
August 10, 1981
Filing Date:
January 07, 1980
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B21C1/00; C25D5/48; C25D7/06; (IPC1-7): B21C1/00; C25D5/48; C25D7/06



 
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