Title:
Fitting structure and mounting instruction of a heat exchanger tube
Document Type and Number:
Japanese Patent JP6178217
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heat transfer pipe attaching structure which can improve heat transfer efficiency and can be produced at low cost in large quantity.SOLUTION: A heat transfer pipe attaching structure comprises a backing plate 2, and a heat transfer pipe 6 attached to the backing plate 2. The backing plate 2 has a groove 5 and in the groove 5 the heat transfer pipe 6 is installed. In the groove 5, a coat 8 for filling in the groove 5 is formed by cold spraying.
Inventors:
Hiroshi Yanagi
Application Number:
JP2013235187A
Publication Date:
August 09, 2017
Filing Date:
November 13, 2013
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
C23C24/04; C23C14/34
Domestic Patent References:
| JP2009062593A | ||||
| JP2013016655A | ||||
| JP2013074199A | ||||
| JP2003121090A | ||||
| JP2011238705A | ||||
| JP2013049091A | ||||
| JP62060858A |
Foreign References:
| WO2014007226A1 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Hirohito Katsunuma
Takeshi Sekine
Kazuya Yamashita
Hirohito Katsunuma
Takeshi Sekine
Kazuya Yamashita