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Patent Searching and Data


Title:
FIXED ABRASIVE GRAIN SAW WIRE
Document Type and Number:
Japanese Patent JP2012071392
Kind Code:
A
Abstract:

To provide a fixed abrasive grain saw wire, as a tool for cutting and working a hard material, having a structure for keeping stable adhesion of abrasive grains without generating cracks in an abrasive grain adhesion layer during cutting working.

The fixed abrasive grain saw wire includes an adhesion layer fixing abrasive grains on a surface layer of a hard steel wire, wherein fibers are mixed in the adhesion layer.


Inventors:
Ogami, Hiroyuki
Application Number:
JP2010000218662
Publication Date:
April 12, 2012
Filing Date:
September 29, 2010
Export Citation:
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Assignee:
KANAI HIROAKI
International Classes:
B24D11/00