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Patent Searching and Data


Title:
FIXED ABRASIVE GRAIN WIRE SAW
Document Type and Number:
Japanese Patent JPH1199465
Kind Code:
A
Abstract:

To restrain abrasion of a guide roller and/or a group roller by coating the surface of the guide roller and/or the group roller with a material having a hardness equal to that of abrasive grain fixed to the surface of a wire with fixed abrasive grains.

The surfaces of a group roller 22 and a guide roller 20 are coated with a material having a hardness equal to that of abrasive grains of a wire 14 with fixed abrasive grains. As in the wire 14 with fixed abrasive grains, diamond abrasive grains, SiC grains or the like are used, the surface of the group roller 22 is also coated with a diamond film or a SiC film. Thus, a difference in hardness between the rollers 20, 22 and the wire 14 is eliminated so that the surface of the groove of the group roller 22 or the like is inhibited from being scraped and worn away by abrasive grains.


Inventors:
TSUKADA SHUICHI
TAGO KAZUHIRO
Application Number:
JP26177097A
Publication Date:
April 13, 1999
Filing Date:
September 26, 1997
Export Citation:
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Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B27/06; B23D57/00; B28B5/04; B28D1/08; (IPC1-7): B24B27/06; B28B5/04; B28D1/08
Attorney, Agent or Firm:
Kenzo Matsuura