Title:
Fixed-abrasive wire saw, its manufacturing method, and work cutting method using it
Document Type and Number:
Japanese Patent JP6352176
Kind Code:
B2
Abstract:
[Object] To provide a fixed abrasive grain wire saw that can improve precision of the cut plane of a workpiece and grinding efficiency and can prolong the product life, a method of manufacturing the fixed abrasive grain wire saw, and a method of machining a workpiece by use of the fixed abrasive grain wire saw. [Solution] To fasten abrasive grains 2 to the outer circumferential surface of a metal core wire 1, a plurality of transfer rollers 18, in each of which many tiny holes 18a filled with an adhesive 3a are formed, are used to transfer the adhesive to the outer circumferential surface of the core wire so as to form, on the outer circumferential surface, a plurality of rows li of punctiform adhesive layers 3 that are linearly arrayed in the axial direction at regular intervals. The abrasive grains are tentatively fastened to the adhesive layers, after which the abrasive grains are permanently fastened with a metal plated layer 4 formed by electrolytic deposition.
Inventors:
Yasuhiro Ueda
Application Number:
JP2014518165A
Publication Date:
July 04, 2018
Filing Date:
May 31, 2012
Export Citation:
Assignee:
Lead Co., Ltd.
International Classes:
B24B27/06; B23D61/18; B24D3/00; B24D3/02; B24D3/06; B24D3/22; B24D11/00; B28D1/22; B28D5/04; H01L21/304
Domestic Patent References:
| JP2004237376A | ||||
| JP201266335A | ||||
| JP2011230258A | ||||
| JP2002172564A | ||||
| JP2007160505A | ||||
| JP2003305652A |
Attorney, Agent or Firm:
Hayashi Naoki
Hiroshi Hayashi
Toru Ishikawa
Hiroshi Hayashi
Toru Ishikawa