Title:
FIXING SUBSTRATE FOR LIGHT-EMITTING ELEMENT
Document Type and Number:
Japanese Patent JPS58125878
Kind Code:
A
Abstract:
PURPOSE:To enable to have a light-emitting element to be attracted to a substrate using proper amount of pressure, to prevent the lowering of characteristics and yield rate as well as to simplify the formation of a light-emitting array by a method wherein a through hole is provided at the position where the light-emitting element will be fixed, and a conductive film is formed around the hole. CONSTITUTION:When a plurality of light-emitting elements 5 are fixed on an insulating ceramic substrate 1 of alumina and the like, first, a conductive film 2 to be used as an electrode in common is coated. Then, a through hole 3 reaching the substrate 1 is provided on the film 2, the through hole is surrounded by a fixing part 4 consisting of solder or conductive bonding agent, the substrate 1 is placed on a vacuum-chuck jig, and each element 5 is fixed temporarily using vacuum attraction applied from the back side of the substrate 1. Subsequently, the back side of the element 5 is fixed permanently on the film 2 by applying heat. Through these procedures, the pressure can be applied to the substrate 1 moderately, and the fixing work of the light-emitting element can also be performed easily without inflicting damage to the element.
Inventors:
MIZUTANI TAKESHI
MATSUKI MIWAO
MATSUKI MIWAO
Application Number:
JP834582A
Publication Date:
July 27, 1983
Filing Date:
January 21, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L25/075; H01L33/08; H01L33/62; (IPC1-7): H01L33/00
Domestic Patent References:
| JP44010415A | ||||
| JPS5394784A | 1978-08-19 |
Attorney, Agent or Firm:
Toshio Nakao
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