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Patent Searching and Data


Title:
LASER DRILLING DEVICE
Document Type and Number:
Japanese Patent JP3151015
Kind Code:
B2
Abstract:

PURPOSE: To improve the working rate and productivity by providing functions for measuring the position, a drilling diameter and a drilling area of each work and functions for controlling the laser power and irradiating time of a laser beam oscillator on a laser drilling device.
CONSTITUTION: The laser drilling device is composed of a laser beam machine 1 for machining a resin mold, laser optical systems 21-25 including a mask for drilling, regulating mechanisms 41-45 for alignment of the works, observation systems 33, 33' for observing the works 81, 82 including an illumination 31, a picture processing device 5 for taking pictures of the works 81, 82 with ITV cameras 34, 34' and measuring the positions, drilling diameters and drilling areas of the works 81, 82 by picture recognition and a controller 6 for controlling these devices and automatically controlling the power and irradiating time of the laser beam machine 1 in accordance with the measured values of the drilling hole diameter and drilling area.


Inventors:
Go Orikasa
Takashi Watanabe
Akira Goto
Fumio Ichikawa
Kazuaki Masuda
Application Number:
JP27388491A
Publication Date:
April 03, 2001
Filing Date:
October 22, 1991
Export Citation:
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Assignee:
Canon Inc
International Classes:
B23K26/382; B23K26/00; B23K26/066; B41J2/135; B41J2/16; B23K101/36; (IPC1-7): B23K26/00; B41J2/135
Domestic Patent References:
JP567431A
JP241790A
JP36505U
Attorney, Agent or Firm:
Yoshikazu Tani (1 person outside)