Title:
FLAGLESS SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3681008
Kind Code:
B2
Abstract:
PURPOSE: To reduce a possibility of internal peeling-off and package cracking by supporting a die by two cantilevered tie bars to reduce an entire surface area of an interface between plastic and metal in a plastic sealed device.
CONSTITUTION: In a device 10, tie bars 18 support a semiconductor die 22. In a device 20, tie bars 18 support a semiconductor die 24. Each time bar 8 includes a stem part 19 and a support part 21. The die 22 extrudes fully on the support part 21 of the tie bar 18 or covers it. In order to avoid the entire support part from being placed under the die, however, the die can be extended beyond the periphery of the die. The devices 10 and 20 are sealed into plastic sealing material, cut off from a lead frame 12 to obtain a completed device. Thereby the area of an entire interface between plastic and metal in the plastic sealed device.
Inventors:
Tom Earl Hollinsworth
Michael B. McShane
Michael B. McShane
Application Number:
JP6435294A
Publication Date:
August 10, 2005
Filing Date:
March 09, 1994
Export Citation:
Assignee:
Freescale Semiconductor, Inc.
International Classes:
H01L21/52; H01L23/28; H01L23/495; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP415947A | ||||
| JP63216365A | ||||
| JP6068639A | ||||
| JP6367260U |
Attorney, Agent or Firm:
Yoshiaki Ikeuchi
Previous Patent: RECORD INFORMATION SEARCH METHOD FOR CD REPRODUCING DEVICE
Next Patent: COMPOSITION FOR TREATING INCONTINENCE
Next Patent: COMPOSITION FOR TREATING INCONTINENCE