To provide an adhesive composition used for a flexible printed circuit, exhibiting excellent flame retardant property without containing phosphorus, and further excellent in normal state bonding strength against peeling, press-processing property, etc., and a cover lay.
This flame retardant adhesive composition is characterized by containing (A) an acrylic rubber containing carboxylic acid as a functional group, (B) a silane-modified epoxy resin obtained by performing the alcohol elimination reaction of (b1) a bisphenol A type epoxy resin with (b2) a hydrolyzable alkoxysilane, (C) a phenol resin, (D) an inorganic filler and (E) a curing agent as indispensable components. The cover lay is produced by forming a resin layer on the surface of a polyimide film with the flame retardant adhesive composition.
HASEGAWA KATSURO
SAKAZAKI SHINJI
| JPS5981369A | 1984-05-11 | |||
| JP2000345035A | 2000-12-12 | |||
| JP2003073641A | 2003-03-12 | |||
| JP2002265906A | 2002-09-18 | |||
| JP2001291964A | 2001-10-19 | |||
| JP2001164226A | 2001-06-19 | |||
| JP2002275445A | 2002-09-25 | |||
| JP2001059013A | 2001-03-06 | |||
| JP2003346838A | 2003-12-05 |