Title:
FLAME-RETARDANT AND HEAT-RESISTANT RESIN COMPOSITION HAVING EXCELLENT FLUIDITY
Document Type and Number:
Japanese Patent JPH06136266
Kind Code:
A
Abstract:
PURPOSE: To provide a polyimide resin composition having excellent flame retardancy as well as fluidity and suitable for printed circuit board for electronic equipment required to have lower dielectric constant.
CONSTITUTION: The flame-retardant and heat-resistant resin composition having excellent fluidity is produced by compounding (A) a heat-resistant resin composition produced by the thermal reaction of a maleimide compound having at least two maleimide groups with a diamine compound with (B) a compound containing halogen atom and having a melting point of 50-130°C.
Inventors:
SASE SHIGEO
OGAWA NOBUYUKI
FUJIOKA ATSUSHI
OGAWA NOBUYUKI
FUJIOKA ATSUSHI
Application Number:
JP30980792A
Publication Date:
May 17, 1994
Filing Date:
October 26, 1992
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08K5/12; C08K5/13; C08K5/18; C08L79/08; H05K1/03; (IPC1-7): C08L79/08; C08K5/12; C08K5/13; C08K5/18
Attorney, Agent or Firm:
Hotaka Tetsuo