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Title:
FLAME-RETARDANT AND HIGHLY HEAT-RESISTANT EPOXY RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
Japanese Patent JP2003048960
Kind Code:
A
Abstract:

To provide a flame-retardant and highly heat-resistant epoxy resin composition developing excellent flame-retardance without using a halogen-based flame-retardant and having high heat-resistance, moisture absorption, etc., and provide the use of the composition.

The flame-retardant and highly heat-resistant epoxy resin composition contains an epoxy resin, a curing agent and optionally a cure accelerator. A phosphorus-containing epoxy resin obtained by reacting an aromatic ring- containing phosphorus compound with an aromatic ring-containing epoxy resin having ≥2 functionality is used as the epoxy resin and a novolak aralkyl resin is used as the curing agent. The invention further provides a prepreg produced by using the composition and usable for electronic circuits and electronic parts, a laminated board produced by using the prepreg and an insulating intermediate layer for a build-up substrate produced by using the composition.


Inventors:
YASUDA KIYOMI
IWAKI YOSHIO
SUZUKI TERUFUMI
NARISAWA HIROAKI
SUZUKI GORO
Application Number:
JP2001241537A
Publication Date:
February 21, 2003
Filing Date:
August 09, 2001
Export Citation:
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Assignee:
MITSUI CHEMICALS INC
International Classes:
C08J5/24; C08G59/30; C08G59/62; (IPC1-7): C08G59/62; C08G59/30; C08J5/24