Title:
ハロゲン無し・燐無し・窒素無し難燃性樹脂組成物、それを含むプリプレグ及び金属張積層板
Document Type and Number:
Japanese Patent JP6845889
Kind Code:
B2
Abstract:
The present invention provides a halogen-free, phosphorus-free, nitrogen-free flame-retardant resin composition; a prepreg comprising the same; and a metal foil-clad laminate. The resin composition comprises, by weight: 100 parts of an epoxy resin; 180-250 parts of boehmite; 180-300 parts of titanium white; and 50-170 parts by weight of a curing agent, wherein the curing agent is a non-phenolic hydroxyl group-based compound and/or a non-amine-based curing agent. The resin composition as an end product obtained by using a combination of boehmite and titanium white in the present invention exhibits a flame retardancy of the level HB with the reactivity not affected. The resin composition provided in the present invention is halogen-free, phosphorus-free, and nitrogen-free, and when packaging an LED with an addition-type silica gel, can prevent silica gel poisoning. In addition, the resin composition of the present invention satisfies the application requirements as LED substrate materials in terms of heat resistance and yellowing resistance.
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Inventors:
Takayo
Tokokubou
Tokokubou
Application Number:
JP2019079088A
Publication Date:
March 24, 2021
Filing Date:
April 18, 2019
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO.,LTD.
International Classes:
C08L63/00; B32B15/08; B32B15/092; B32B17/04; C08G59/06; C08G59/42; C08K3/22; C08L35/06; H05K1/03
Domestic Patent References:
| JP2018502937A |
Foreign References:
| WO2012132965A1 |
Attorney, Agent or Firm:
Norihito Yamao
Masaishi Nishishita
Tsuyoshi Sato
Masaishi Nishishita
Tsuyoshi Sato