To provide: a non-halogen flame retardant resin compound having a good balance between all of flame retardancy, metal foil adhesivity, heat resistance, moisture resistance and dielectric characteristics, and suitably usable for electronic parts or the like; a thermosetting resin composition and a prepreg and a laminate using the non-halogen flame retardant resin compound.
The flame retardant resin compound is produced by reacting a compound (a), which is obtained from an N-substituted maleimide compound and an amine compound having an acid substituent, with a phosphorus-containing epoxy resin (b) in an organic solvent. The thermosetting resin composition includes: a solution (A) of the flame retardant resin compound; a 6-substituted guanamine compound (B); a copolymer resin (C) from a styrene compound or a vinyl compound and a maleic anhydride; an epoxy resin (D); a hardener (E) for an epoxy resin having an acid substituent; and an inorganic filler (F). The prepreg and a laminate are produced using the thermosetting resin composition.
TSUCHIKAWA SHINJI
MIYATAKE MASATO
| JP2008163305A | 2008-07-17 | |||
| JP2009024146A | 2009-02-05 | |||
| JP2008110959A | 2008-05-15 | |||
| JPH0632969A | 1994-02-08 | |||
| JP2002317085A | 2002-10-31 |
Tamotsu Otani
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