To provide a flap table that enables wiring work to be properly performed even when a top board is large for example.

On a top board 2 that performs flap operation, wiring take-out ports 26 are provided in the center surface in the top board depth direction Y orthogonal to a spindle m1 that is an axis in the center of the flap operation. As a result, including use from the top board edges m and n at which both sides in the top board depth direction Y are positioned, access from each position is fully made possible, with wire bundling work also facilitated. Thus, an environment for easily using pieces of electronic devices can be prepared even with a flap table.