Title:
FLAT BOARD STAMPING DEVICE
Document Type and Number:
Japanese Patent JP3780445
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve a stamping power while maintaining high speed and to facilitate a manufacturing work.
SOLUTION: A flat board stamping device is provided with a movable unit B with a head board 21 which can be moved up and down freely to a fixed unit A with a lower board 11 by means of an elevation drive mechanism C. The elevation drive mechanism C is provided with a toggle mechanism C1 that transmits a bending and stretching motion of two link levers 31, 32 to the movable unit B to move it up and down, and an eccentric mechanism C2 which pushes and pulls the journalled part of the both link levers. One end of a connection lever 40 which is connected by a shaft 39 so that it can rotate freely is connected to the tip of an operation lever 38 of the eccentric mechanism C2, and the other end is connected to the journalling parts of both link levers. A sliding member 41 is journalled at both ends of the shaft 39 and is fitted into a horizontal guide groove 42 formed in the prescribed part to support the shaft 39 so that it can move back and forth in horizontal direction. The sliding surface of the guide groove 42 is formed to be a recessed shape of an arc facing each other vertically. And the outside wall surface to be fitted for the sliding member is formed to be a protruded shape of the arc to be fitted with the recessed surface of the groove 42.
Inventors:
Kobayashi Koichi
Application Number:
JP37632498A
Publication Date:
May 31, 2006
Filing Date:
December 22, 1998
Export Citation:
Assignee:
Kobayashi Punching Craft Co., Ltd.
International Classes:
B26F1/40; (IPC1-7): B26F1/40
Domestic Patent References:
| JP2581396Y2 | ||||
| JP61124723A | ||||
| JP59070923U |
Attorney, Agent or Firm:
Hajime Wada