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Patent Searching and Data


Title:
FLAT HEAT PIPE
Document Type and Number:
Japanese Patent JP2013011363
Kind Code:
A
Abstract:

To provide a heat pipe capable of improving maximum heat transport performance by performing protection against the intrusion of a wick in a thin groove formed at the inner peripheral surface of a container to reduce overall heat resistance losses.

In the heat pipe 10, a working fluid which is heated, evaporated, dissipated in heat, and condensed is filled, and a wick 17 which generates a capillary force that returns the working fluid in a liquid phase to a position where the working fluid is evaporated is disposed, and a plurality of thin grooves 15 are formed at the inner peripheral surface in an axial direction. An interposing member 18 for preventing the intrusion of the wick 17 into the thin groove 15 is disposed at the inner peripheral surface. Thus, in the thin groove 15 not clogged by the wick 17, the working fluid is easily returned. As a result, the overall heat resistance losses are reduced, and the maximum heat transfer performance is improved.


Inventors:
AHAMED MOHAMMAD SHAHED
KAWAHARA YOJI
SAITO YUJI
MOCHIZUKI MASATAKA
TAHARA YUICHIRO
Application Number:
JP2011142552A
Publication Date:
January 17, 2013
Filing Date:
June 28, 2011
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
F28D15/02
Domestic Patent References:
JP2003247791A2003-09-05
JPS56154681U1981-11-18
JPH11294980A1999-10-29
JP2009115346A2009-05-28
JP3113254U2005-09-02
JP2004053186A2004-02-19
Foreign References:
US20080105405A12008-05-08
Attorney, Agent or Firm:
Watanabe strong