To provide a flat surface SQUID sensor with less damage due to a thermal cycle, to which an external connection cable can be soldered.
A copper terminal (2) for external connection soldering, a copper terminal (3) for detection coil pad, and a copper terminal (2a) for heater resistance soldering are laminated on a polyimide substrate (1). On the surface of the polyimide substrate, an Nb thin film detecting coil (4) is formed by sputtering, and a SQUID chip (5) is mounted. These are connected by superconducting bonding (6) and Al bonding (7). The following effects are obtained: The sensor endures sputtering process, there is no damage due to a thermal cycle, the sensor is prevented from being cracked owing to a difference of thermal expansion between a molding material and the polyimide substrate (1), an external connection cable can be connected by soldering, and heater resistance can be mounted by soldering.
SHIMOZU TATSUYUKI
KAWABATA MIKI
KANAZAWA INST OF TECHNOLOGY
| JP2004235197A | 2004-08-19 | |||
| JP2005322831A | 2005-11-17 | |||
| JPH0499979A | 1992-03-31 | |||
| JPH05302966A | 1993-11-16 | |||
| JPH07302932A | 1995-11-14 |