Title:
平坦化マイクロエレクトロニクス基板
Document Type and Number:
Japanese Patent JP2005516406
Kind Code:
A
Abstract:
The instant invention is a process for planarizing a microelectronic substrate with a cross-linked polymer dielectric layer, comprising the steps of: (a) heating such a substrate coated with a layer comprising an uncured cross-linkable polymer and a glass transition suppression modifier to a temperature greater than the glass transition temperature of the layer, the temperature being less than the curing temperature of the uncured cross-linkable polymer to form a substrate coated with a heat flowed layer; and (b) heating the substrate coated with the heat flowed layer to a curing temperature of the uncured cross-linkable polymer of the heated layer to cure the uncured cross-linkable polymer to form a planarized substrate wherein the percent planarization at 100 micrometers is greater than fifty percent. The instant invention is a microelectronic device made using the above-described process. The instant invention is a composition of matter, comprising: an essentially solvent free composition comprising an uncured cross-linkable polymer and a glass transition suppression modifier, the composition having a glass transition temperature sufficiently less than the curing temperature of the uncured composition so that if the uncured composition is heated to a temperature above its glass transition temperature but below its curing temperature, the uncured composition will flow.
Inventors:
Foster, Kenneth El.
Rudler, Michael Jay
Rudler, Michael Jay
Application Number:
JP2003564109A
Publication Date:
June 02, 2005
Filing Date:
November 06, 2002
Export Citation:
Assignee:
Dow Global Technologies Incorporated
International Classes:
H01L21/768; C08F2/46; C08G61/10; H01B3/30; H01B3/44; H01L21/312; H05K3/28; H05K3/46; H05K1/00; (IPC1-7): H01L21/312; H01L21/768
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama