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Title:
FLEX RIGID PRINTED BOARD AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JPH07193370
Kind Code:
A
Abstract:

PURPOSE: To provide a flex rigid printed board excellent in junction reliability between an inner layer circuit of a flexible board and a through hole circuit of a through hole, and its manufacturing method.

CONSTITUTION: A bendable flex part 92 is coupled with a hard rigid part 91. The flex part 92 comprises a flexible board 12 composed of an inner layer circuit 55; a base film 120 providing the inner layer circuit 55; and a coverley 129 provided so as to cover the inner layer circuit 55. The rigid part 92 extends the flexible board 12 and rigid substrates 111, 112 are laminated and fixed via an adhesive member 11 on both sides of the flexible board. The rigid part 91 has a through hole 10 providing a through hole circuit 50 which is electrically connected with the inner layer circuit 55, and an inner wall of the through hole does not come into contact with the coverley 129.


Inventors:
ADACHI SHINJI
Application Number:
JP34803893A
Publication Date:
July 28, 1995
Filing Date:
December 25, 1993
Export Citation:
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Assignee:
IBIDEN CO LTD
International Classes:
H05K1/02; H05K3/46; H05K3/00; (IPC1-7): H05K3/46; H05K1/02
Attorney, Agent or Firm:
Yoshiyasu Takahashi



 
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