Title:
多重信号伝送用可撓性回路基板
Document Type and Number:
Japanese Patent JP7267367
Kind Code:
B2
Abstract:
The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.
Inventors:
Chobyung-Hun
Kim Ikusu
Kim Byung-Yol
Jung Hee-Suk
Kim Ikusu
Kim Byung-Yol
Jung Hee-Suk
Application Number:
JP2021149900A
Publication Date:
May 01, 2023
Filing Date:
September 15, 2021
Export Citation:
Assignee:
GIGALANE CO., LTD.
International Classes:
H05K1/02; H01P3/00; H01P3/08; H01P3/12
Domestic Patent References:
| JP2003204128A | ||||
| JP1041630A | ||||
| JP2019516231A | ||||
| JP200128506A | ||||
| JP2006245863A | ||||
| JP2012138471A | ||||
| JP2018125491A |
Foreign References:
| US7145411 | ||||
| US20140139300 | ||||
| CN208210411U |
Attorney, Agent or Firm:
Patent Attorney Corporation Washida International Patent Office
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