Title:
CMPプロセスにおけるフレキシブル洗浄ステップ
Document Type and Number:
Japanese Patent JP2008515182
Kind Code:
A
Abstract:
The present invention relates to chemical mechanical planarizing (CMP) and to an apparatus for performing such a CMP process. The method and apparatus according to the invention prevent or at least minimize the time during which a wafer is exposed to air in between two subsequent polishing steps during a CMP process by adjusting the time period of the rinsing steps such that each rinsing step ends at substantially the same time. In that way, damage such as corrosion can be avoided or at least minimized and high quality devices can be achieved.
Inventors:
Viet, Nguyen, Hoang
Application Number:
JP2007533018A
Publication Date:
May 08, 2008
Filing Date:
September 15, 2005
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L21/304; B24B37/04; B24B49/00
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki