Title:
Flexible copper-clad laminate
Document Type and Number:
Japanese Patent JP6320031
Kind Code:
B2
Abstract:
The present invention provides a flexible copper-coated laminated plate used in an FPC foldingly contained in a housing of electronic equipment. The flexible copper-coated laminated plate comprises: a polyimide layer having the thickness within the range from 5 [um]m to 30 [mu]m and a tensile module of elasticity within the range from 4 GPa to 10 GPa; and a copper foil laminated on at least one surface of the polyimide layer and having the thickness within the range from 6 [um]m to 20 [mu]m and a tensile module of elasticity within the range from 25 GPa to 35 GPa, wherein ten-point average roughness of the copper foil at the surface of the side connected with the polyimide layer is within the range from 0.7 [mu]m to 2.2 [mu]m, wiring circuit processing is performed on the copper foil to form that a folding coefficient [PF] of any one FPC of the copper wiring calculated by the following formula in a flexing test with the gap of 0.3mm is within the range of 0.96 +/- 0.025. [PF] = (|epsilon| - epsilon C)/|epsilon|. In the formula, |epsilon| represents the absolute value of a bending average strain value of the copper wiring, and epsilon C represents tensile elastic limiting strain of the copper wiring.
Inventors:
Toshiyuki Nakabayashi
Shigematsu Sakurako
Fujimoto Nobuyoshi
Shigematsu Sakurako
Fujimoto Nobuyoshi
Application Number:
JP2013267806A
Publication Date:
May 09, 2018
Filing Date:
December 25, 2013
Export Citation:
Assignee:
Nippon Steel & Sumikin Chemical Co., Ltd.
International Classes:
B32B15/08; B32B15/088; B32B27/34; H05K1/03
Domestic Patent References:
| JP2007273766A | ||||
| JP2011166078A | ||||
| JP2009246201A | ||||
| JP2008098613A | ||||
| JP2014080021A | ||||
| JP2012006200A |
Foreign References:
| WO2012020677A1 | ||||
| KR1020140042684A | ||||
| WO2006107043A1 |
Attorney, Agent or Firm:
Kazuhiro Watanabe
Katsumi Hoshimiya
Tatsuya Josawa
Katsumi Hoshimiya
Tatsuya Josawa