Title:
軟性銅箔積層フィルム及びその製造方法
Document Type and Number:
Japanese Patent JP7171912
Kind Code:
B2
Abstract:
A flexible copper clad laminate and a method for producing same are disclosed. The flexible copper clad laminate comprises: a non-conductive polymer substrate; a polymer-containing adhesive layer positioned on at least one surface of the non-conductive polymer substrate; a nickel-containing plating layer positioned on one surface of the polymer-containing adhesive layer; and a metal plating layer positioned on one surface of the nickel-containing plating layer.
Inventors:
Yong Ho Lee
Woo Duk Jung
Byung Guk Yi
John Doc Yi
Woo Duk Jung
Byung Guk Yi
John Doc Yi
Application Number:
JP2021520896A
Publication Date:
November 15, 2022
Filing Date:
July 01, 2019
Export Citation:
Assignee:
TORAY ADVANCED MATERIALS KOREA INCORPORATED
International Classes:
C23C28/02; B32B15/08; C09J7/28; C09J183/04; C09J201/00; C25D5/56
Domestic Patent References:
| JP6021157A | ||||
| JP2002050851A | ||||
| JP2005193400A | ||||
| JP2006175634A | ||||
| JP2006213872A | ||||
| JP2008179127A | ||||
| JP2011153372A | ||||
| JP2014179638A |
Foreign References:
| KR1020170071205A |
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe
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