PURPOSE: To prepare a flexible epoxy resin composition which is rapidly curable at room temperature, and useful as a high performance cold-setting adhesive, by compounding an epoxy resin with a carboxyl group-containing liquid chloroprene polymer.

CONSTITUTION: A flexible epoxy resin composition comprising (A) a bisphenol A-type epoxy resin, pref, a liquid epoxy resin having am epoxy equvalent of 100W 1000, (B) a liquid chloroprene polymer having a number average molecular weight of 500W10000 and an average number of carboxyl group of ≥1.5 molecule, and (C) a curing agent such as xylylendediamine, etc. The amount of the chloroprene polymer is 5W200 parts per 100 parts of the epoxy resin. 20W100 parts of the chloroprene-content is especially preferable with regar to the balance of the shear strenbth the and the peeling strength of the adhesive layer. The chloroprene polymer is prepared by the copolymerization of chloroprene monomer, a copolymerizable monomer, and an unsaturated carbosylic acid, using 0.5W20 PHM of thioglycolic acid as a chain transfer agent.