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Title:
伸長性基材上の可撓性かつ伸長性プリント回路
Document Type and Number:
Japanese Patent JP7085022
Kind Code:
B2
Abstract:
The present disclosure is flexible and stretchable conductive articles that include a printed circuit and a stretchable substrate. The printed circuit contains an electrically conductive trace. The electrically conductive trace may be positioned on the surface of or be imbibed into the pores through the thickness of a synthetic polymer membrane. The synthetic polymer membrane is compressed in the x-y direction such that buckling of the membrane occurs in the z-direction. Additionally, the synthetic polymer membrane may be porous or non-porous. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable substrate. Advantageously, the flexible, conductive articles retain conductive performance over a range of stretch. In some embodiments, the conductive articles have negligible resistance change when stretched up to 50% strain. The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.

Inventors:
Mark Dee Edmundson
Paul Dee Gusler
Application Number:
JP2020562630A
Publication Date:
June 15, 2022
Filing Date:
May 08, 2018
Export Citation:
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Assignee:
W.L. GORE & ASSOCIATES, INCORPORATED
International Classes:
H05K1/02; B32B27/00; H01B7/06; H05K1/03
Domestic Patent References:
JP5964640A
JP59187845A
Foreign References:
WO2017065272A1
US20160162774
US20160358849
US20040192082
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Satoshi Deno
Atsushi Ebiya
Naonori Koda
Naoki Kobayashi