FLEXIBLE HALOGEN-FREE EPOXY RESIN COMPOSITION, METALLIC FOIL WITH RESIN, COVER-LAY FILM, PREPREG, LAMINATE FOR PRINTED WIRING BOARD, METAL-CLAD FLEXIBLE LAMINATE

Japanese Patent JP2009108144

A

To provide a flexible halogen-free epoxy resin composition ensuring demanded flame retardancy without using halogen and satisfying adhesiveness, electrical insulation reliability, heat resistance, and flexibility required in application for a flexible printed wiring board and the like.

The flexible halogen-free epoxy resin composition comprises a component A and one or both of components B and C. A mixing total amount of the components B and C is 30-50 mass% based on the total amount of the flexible halogen-free epoxy resin composition. The component A is a naphthalene-skeleton epoxy resin. The component B is a block copolymer type thermoplastic resin and the like consisting of a soft component and a rigid component. The component C consists of a soft thermoplastic resin and the like C1 with Tg of lower than 25C and a rigid thermoplastic resin and the like C2 with Tg of 25C or higher.

KOSEKI TAKAYOSHI
EZAKI YOSHIAKI
OKUNO SHINJI
ISHIKAWA YOSUKE
KATO TETSUYA

JP2007279680A

May 21, 2009

October 26, 2007

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PANASONIC ELEC WORKS CO LTD

C08L63/00; B32B15/08; B32B15/092; C08G59/24; C08G59/62; C08J5/24; C08K5/49; C08L53/00; C08L101/12; C09J11/00; C09J153/00; C09J163/00; H05K1/03; H05K3/28

JP2002069270A	2002-03-08
JP2007266560A	2007-10-11

WO2006051820A1

2006-05-18

Keisei Nishikawa
Atsuo Mori

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