Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FLEXIBLE INORGANIC FIBROUS SEWN HEAT-INSULATING STRUCTURE AND METHOD FOR PRODUCING THE STRUCTURE
Document Type and Number:
Japanese Patent JP3799388
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a flexible inorganic fibrous sewn heat-insulating structure suitable for heat insulating materials usable at ≥1,300°C such as surface protecting materials for a spaceplane or space shuttle, having highly heat-resisting property, thermal shock resistance and heat insulating properties and easily attachable to cabinets having complicated shapes, and to provide a method for producing the structure.
SOLUTION: This flexible inorganic fibrous sewn heat-insulating structure is formed by entwining an inorganic fiber mixture of mullite fibers and silica fibers with an organic binder to form an inorganic fibrous board having enough strength for sewing without deformation, interposing the inorganic board between surface layer materials, stitching and integrating the resultant product with a heat resistant inorganic continuous fiber coated with a fluororesin, and then, burning the organic binder down.


Inventors:
Kazuyuki Miho
Fumito Takeda
Junichi Ogawa
Toshiyuki Aji
Kawasaki Yoshihiro
Application Number:
JP28108099A
Publication Date:
July 19, 2006
Filing Date:
October 01, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Japan Aerospace Exploration Agency
MITSUBISHI HEAVY INDUSTRIES,LTD.
Nichias Corporation
International Classes:
B32B5/02; C04B35/80; D04H1/4209; (IPC1-7): C04B35/80; B32B5/02; D04H1/42
Domestic Patent References:
JP8306636A
JP10226559A
JP3249276A
JP2046895U
Attorney, Agent or Firm:
Kenji Akatsuka
Yasuo Fukuda