PURPOSE: To improve soldering resistance, dimensional stability, flexibility, and electrical characteristics by impregnating aromatic polyimide fiber unwoven fabric previously surface-treated with all aromatic amide-imide resin with a specific resin composition, and laminating a metal foil on one surface of the unwoven fabric and curing the unwoven fabric.

CONSTITUTION: Aromatic polyamide fiber unwoven fabric previously surface- treated with all aromatic amide-imide resin is impregnated with a resin composition containing 10-60weight% urethane acrylate of about 2000 or more average molecular weight, 10-50weight% epoxy acryrate, and 20-60weight% crosslinking monomer. A metal foil is laminated at least on one surface of the unwoven fabric and thereafter cured. Hereby, a title laminate board is useable as printed boards for high density packaging and surface packaging. Further, the laminate plate can be manufactured continuously to reduce the manufacturing cost.