PURPOSE: To provide a packaging method capable of connecting optically to optional multipoints and with high precision and with high density, in an optical integrated circuit connecting among plural electronic elements optically.
CONSTITUTION: Plural electronic elements 6 are loaded on an electronic circuit sustrate 9, and further, a light emitting or a light receiving elements is bonded adjacent to them. The light emitting element is a laser diode 3 in junction up, and is joined to a substrate wiring pattern 8 through a sub mount 4. Further, the light receiving element 5 is Joined to the substrate wiring pattern 8 by flip chip bonding. A flexible optical waveguide circuit substrate 1 and an optical waveguide 2 are joined to the laser diode 3 or the light receiving element 5 on a surface opposing to the electronic circuit substrate 9. Thus, the optical connection to optional multipoints is enabled without attenuating and interfering a signal. Further, regardless of the positional deviation of bonding of the optical/ electronical elements to the substrate, the highly precise optical connection is attained.
CHIBA KATSUAKI
SUZUKI TOMOHIRO
MIYAZAKI TAKAO
MATSUOKA YOSHIKO
