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Patent Searching and Data


Title:
FLEXIBLE PRINTED WIRING BOARD AND COVER LAY FILM
Document Type and Number:
Japanese Patent JPH02301186
Kind Code:
A
Abstract:

PURPOSE: To obtain excellent adhesive strength, heat resistance, weather resistance, and electric insulating property by using a certain specific composition as an adhesive for bonding a plastic film with a metallic foil or mold separating paper.

CONSTITUTION: An adhesive consists of a composition which includes an ethylene acrylic copolymer containing carboxyl group, epoxy resin, and a hardener. For the compounding ratio of ethylene acrylic copolymer containing carboxyl group to epoxy resin, the ethylene acrylic copolymer containing carboxyl group is 20-90wt.%, and epoxy resin is 10-80wt.%. This adhesive solution is applied to a polyimide film after being dried, and it is dried. Thereafter, an electrolytic copper foil is stacked, and is bonded by pressing and is heated and cured after so as to obtain a flexible printed wiring board. On the other hand, this adhesive solution is applied to a polyimide film, and after drying mold separating paper is laminated so as to manufacture a cover lay film.


Inventors:
FUJII YOSHITO
YANAGISAWA YOSHIFUMI
Application Number:
JP12224189A
Publication Date:
December 13, 1990
Filing Date:
May 15, 1989
Export Citation:
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Assignee:
NIKKAN IND
International Classes:
B32B15/08; B32B7/12; C09J163/00; H05K3/28; H05K3/38; (IPC1-7): B32B7/12; B32B15/08; C09J163/00; H05K3/28; H05K3/38
Attorney, Agent or Firm:
Naotaka Ide