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Title:
FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP01114096
Kind Code:
A
Abstract:

PURPOSE: To satisfy various performance requirements of a flexible printed wiring board simultaneously by a method wherein an electrical insulating layer is made of polyurea resin which is obtained by the reaction between amine system compound of a specific composition and polyisocyanate compound and the like.

CONSTITUTION: Amine compound with a composition shown by the formula, aromatic polyamine and polyisocyanate compound are made to react with each other and cured. In the formula, R denotes n-valent polyalkylene, polyalkylene ester or polyalkylene polyester with an average molecular weight not less than 200. (A) denotes oxygen atom or imino group. (n) denotes positive integer 1, 2 or 3 and (m) denotes positive integer 2, 3 or 4. Electrical insulating layer made of polyurea resin obtained like this is used as the material of a substrate or a cover-lay film. As a result, a flexible printed board which has excellent solderability, foldability and adhesiveness and conforms to various high performance requirements of a flexible printed board and can be manufactured with a low cost can be obtained.


Inventors:
Sato, Yuichiro
Koyaizu, Zenjiro
Hattori, Masaaki
Application Number:
JP1987000270223
Publication Date:
May 02, 1989
Filing Date:
October 28, 1987
Export Citation:
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Assignee:
IHARA CHEM IND CO LTD
International Classes:
H05K1/03; H05K1/03; (IPC1-7): H05K1/03



 
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