To provide a flexible printed wiring board capable of sufficiently reducing defective soldering.

Holes 20, 11a are formed in sections where the main body section 17a of an IC 17 with a connecting terminal 17b connected to the land section 16 of a conductor 14 and the main body section 18a of a connector 18 with a connecting terminal 18b joined with the land section 16 of the conductor 14 are placed, in the flexible printed wiring board 10, in which a reinforcing plate 11 is installed to the lower section of a base film 13, in which the patterned conductor 14 is formed in an upper section, through pressure-sensitive adhesives 12, respectively so that the pressure-sensitive adhesives 12 are exposed.