PURPOSE: To allow highly accurate positioning by minimizing the damage to a semiconductor chip with a configuration of a series of automatic devices for transfer, attraction, and position detection, and by reducing the waiting time of a collet during one cycle.
CONSTITUTION: A semiconductor chip 27 that is transferred onto a bonding tool 28 by an attraction collet is heated with a heater 29, and the position of it is detected with a position detection means 45. The position of a circuit substrate 40 is also detected. Then, the bonding tool 28 rotates around the rotation center 38 by 180° and compensates the amount and the distance C between then each detected by a position detection means 45 and 44 with a positioning means 42 and then presses the semiconductor chip 27 on the bonding tool 28 on the B side onto the lead section on the circuit substrate 40 by means of cylinders 33 and 35 after the positioning. During this operation, the bonding tool on the A side performs the process of transfer, attraction, and position detection at the same time, and the bonding tool 28 completes one cycle operation by resetting with spring 37 when the bonding is completed.
MAKINO YUTAKA
YAMAMOTO AKIHIRO
| JPS59186333A | 1984-10-23 | |||
| JPS5972145A | 1984-04-24 |
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