Title:
FLIP-CHIP MOUNTING BOARD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2000091478
Kind Code:
A
Abstract:
To provide a flip-chip mounting board for semiconductor device having high mounting density and superior in heat dissipating properties.
This flip-chip mounting board comprises a sub-board 2 for flip-chip mounting a bare chip 1 of semiconductor device, and a motherboard 6 which is fixed with the sub-board in order to contain the bare chip. A cavity 5 for containing the bare chip is formed in the motherboard, and a step 12 to be fitted with the circumferential part of the sub-board is formed at a position surrounding the cavity.
Inventors:
AIZAWA TAKASHI
Application Number:
JP27932798A
Publication Date:
March 31, 2000
Filing Date:
September 16, 1998
Export Citation:
Assignee:
NEC TOHOKU LTD
International Classes:
H05K1/18; H01L21/60; H01L23/12; H01L23/28; H01L23/34; H01L25/04; H01L25/18; (IPC1-7): H01L23/34; H01L21/60; H01L23/12; H01L23/28; H05K1/18
Attorney, Agent or Firm:
Jo Hori
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