Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
FLIP-CHIP PACKAGING METHOD
Document Type and Number:
Japanese Patent JP2015002240
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flip-chip packaging method capable of easily suppressing generation of chipping and cracks in a semiconductor element at ultrasonic flip-chip packaging.SOLUTION: In a flip-chip packaging method, a semiconductor element 1 is sucked and held by a suction nozzle 2 and arranged on a substrate 3, and by adding ultrasonic vibration while weighting the semiconductor element 1 to the substrate 3 side, the semiconductor element 1 is flip-chip-packaged on the substrate 3. A surface roughness Ra of a contact surface 1a to the suction nozzle 2, of the semiconductor element 1 before packaging is 0.1 μm or more and less than 0.5 μm.

More Like This:
JPH05211193WIRE BINDING METHOD
JP2012160610METHOD FOR MANUFACTURING CONNECTED STRUCTURE
JP6864009Assembly platform
Inventors:
ITO MASANORI
Application Number:
JP2013125571A
Publication Date:
January 05, 2015
Filing Date:
June 14, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI METALS LTD
International Classes:
H01L21/60
Domestic Patent References:
JP2003163240A2003-06-06
JP2003203953A2003-07-18
JP2003347362A2003-12-05
JPH10107078A1998-04-24
JP2006019342A2006-01-19
JP2001298251A2001-10-26
Attorney, Agent or Firm:
Nobuo Kinutani



 
Previous Patent: NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND METHOD OF MANUFACTURING THE SAME

Next Patent: SUBSTRATE IMAGING DEVICE, AND SUBSTRATE IMAGING METHOD